Home > Newly Shipped PCB > Panasonic Megtron6 (M6) R-5775 PCB – High-Speed, Low-Loss Multilayer PCB for 5G, Automotive, and High-Performance Computing

Panasonic Megtron6 M6 High-Speed Low-Loss PCB
PCB Material:Panasonic Megtron6 (M6) / 2.0mm
MOQ:1PCS
Price:79.99-299 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:12-20 working days
Payment Method:T/T, Paypal
 

Panasonic Megtron6 (M6) R-5775 PCB – High-Speed, Low-Loss Multilayer PCB for 5G, Automotive, and High-Performance Computing


1.Overview:

Explore the advanced Panasonic Megtron6 (M6) R-5775 laminate, a premier multilayer copper-clad laminate (CCL) engineered for high-frequency, high-speed, and dependable electronic applications. Ideal for 5G communications, millimeter-wave radar, high-speed servers, and high-performance computing (HPC), M6 stands out with its remarkably low dielectric loss (Df), stable dielectric constant (Dk), and superior thermal reliability, perfectly addressing the rigorous demands of modern high-frequency signal transmission.


2.Key Features:

Dielectric Constant: 3.4 at 1GHz/23°C; 3.34 at 13GHz
Dissipation Factor: 0.002 at 1GHz/23°C; 0.0037 at 13GHz
Thermal Properties: High Tg value exceeding 185°C and thermal decomposition temperature of 410°C
Design Flexibility: Supports multilayer PCB designs ranging from 4 to 30 layers, accommodating complex circuit requirements
Eco-Friendly Manufacturing: Complies with RoHS and halogen-free standards, aligning with green manufacturing practices
Cost-Effective Processing: Compatible with traditional FR-4 technology, eliminating the need for special equipment and reducing production costs
Flammability Rating: UL 94V-0 certified


3.PCB Stackup: 16-layer rigid PCB

LayerMaterialThickness
Copper_layer_1Copper foil35 μm
Prepreg R-5670(G) 1080 X 185.1 μm
Copper_layer_2Copper foil17 μm
M6 Core R5775G(HVLP)96 μm
Copper_layer_3Copper foil17 μm
Prepreg R-5670(G) 3313 X 199.4 μm
Copper_layer_4Copper foil17 μm
M6 Core R5775G(HVLP)96 μm
Copper_layer_5Copper foil17 μm
Prepreg R-5670(G) 3313 X 199.4 μm
Copper_layer_6Copper foil17 μm
M6 Core R5775G(HVLP)96 μm
Copper_layer_7Copper foil35 μm
Prepreg R-5670(G) 3313 X 199.4 μm
Copper_layer_8Copper foil35 μm
M6 Core R5775G(HVLP)96 μm
Copper_layer_9Copper foil17 μm
Prepreg R-5670(G) 3313 X 199.4 μm
Copper_layer_10Copper foil17 μm
M6 Core R5775G(HVLP)96 μm
Copper_layer_11Copper foil17 μm
Prepreg R-5670(G) 3313 X 199.4 μm
Copper_layer_12Copper foil17 μm
M6 Core R5775G(HVLP)96 μm
Copper_layer_13Copper foil17 μm
Prepreg R-5670(G) 3313 X 1B99.4 μm
Copper_layer_14Copper foil17 μm
M6 Core R5775G(HVLP)96 μm
Copper_layer_15Copper foil17 μm
Prepreg R-5670(G) 1080 X 185.1 μm
Copper_layer_16Copper foil35 μm

4.PCB Construction details:

Board dimensions: 110 mm x 110 mm = 1PCS, +/- 0.15mm
Minimum Trace/Space: 3/4 mils
Minimum Hole Size: 0.2mm
No Blind vias.
Finished board thickness: 2.0mm
Finished Cu weight: 1oz (1.4 mils) outer layers, 0.5oz /1oz inner layers
Via plating thickness: 25 μm
Surface finish: Electroless Nickle Immersion Gold (ENIG)
Top Silkscreen: White
Bottom Silkscreen: White
Top Solder Mask: Green
Bottom Solder Mask: Green
0.2mm via filled and capped
100% Electrical test used prior to shipment


5.Impedance Control:

Single-end, L1 11.8mil, 75ohm, reference layer 4
Single-end, L1, 5.9mil, 50 ohm, reference layer 2
Single-end, L16, 5.9mil, 50 ohm, reference layer 15
Differential, L1, 5.9mil/7.87mil, 100 ohm, reference layer 2
Differential, L10, 3.94mil/5.9mil, 100 ohm, reference layer 9
Differential, L12, 3.94mil/5.9mil, 100 ohm, reference layer 11, layer 13


M6 High Speed Low Loss 16-Layer PCB 2.0mm Thick


6.PCB Statistics:

Components: 154
Total Pads: 406
Thru Hole Pads: 137
Top SMT Pads: 121
Bottom SMT Pads: 148
Vias: 532
Nets: 9


7.Accepted Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping


8.Typical Applications:

5G Communication Base Stations: Millimeter-wave antennas and RF front-ends for AAUs (Active Antenna Units)
Automotive Electronics: 77GHz millimeter-wave radar for Advanced Driver Assistance Systems (ADAS)
Data Centers: High-speed server motherboards and 400G/800G optical module PCBs
Aerospace: High-frequency circuit boards for satellite communication and radar systems
Consumer Electronics: High-frequency Wi-Fi 6E/7 routers and AR/VR devices


 

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